| 摘要 |
PURPOSE:To provide a new composition composed of a specific curing agent, an epoxy resin and a cure accelerator and having high reliability in hot humid atmosphere or after soldering and excellent light-transmittance. CONSTITUTION:This resin composition is composed of (A) a curing agent of the formula (R is H, methyl or ethyl), (B) an epoxy resin (e.g. bisphenol A epoxy resin) and (C) a cure accelerator (e.g. trimethylamine or triphenyl phosphine). |
