| 摘要 |
<p>PURPOSE:To eliminate the internal stress from resin onto an element due to the thermal expansion difference, by covering a semiconductor element placed on a lead frame and a connecting wire by using resin caps, and subsequently fixing the area surrounding the sealed part. CONSTITUTION:Semiconductor element 1 is placed in the center of lead frame 2, and the electrode provided on this is connected to the lead of the frame by means of connecting wire 3. Next, the tip of the lead is projected outward, and element 1 and the upper and lower parts of wire 3 are covered with resin caps 5 and 5', made of the same material as ordinary sealing resin. The edges in contact are fixed by means of thermosetting epoxy resin 6. By this, hollow part 7 is produced around element 1 and the upper and lower parts of the wire and they do not come into contact with the caps. Consequently, the internal stress due to the resin does not apply to element 1, and further, wire 3 is prevented from shifting due to the shifting of the resin.</p> |
