| 摘要 |
PURPOSE:To prevent the lowering of the performance of mounting due to the oxidation of a pad, etc. for a junction by sealing a base member and a cap member of a package in the device with shape of which a lead-out lead is exposed with low-melting point multielement metal solder. CONSTITUTION:A pellet 14 is fixed into a concave section 12 of a base 10 made of ceramics through a metallized layer 13. The lead 16, which is deisposed to a base stepped section 15 and connected to the pellet by wires, passes in a surrounding section 18, and is extended and mounted to the outside of the base as the pad 19 for the junction, and spare solder 22 is attached onto the surface of the pad 19. A lower surface 23 of the cap 11 made of ceramics is arranged being opposed to the base surrounding section 18, and fusion-welded and sealed with the low-melting point solder 24 obtained by adding Zn, Sb, etc. to Pb and Sn. Accordingly, since sealing can be completed in a short time at 120-400 deg.C, the lowering of the adhesive property of solder of the pad 19 for the junction at the outer end section of the lead 16 and the oxidation of the spare solder 22 can be prevented, and the performance of mounting can be improved. |
