发明名称 |
METHOD OF PRODUCING THERMAL CONDUCTIVE ASSEMBLY |
摘要 |
A leaf-type cooling device for coupling a semi-conductor chip package to a heat sink is formed by accordion pleated folding of two copper strips coated on their non-mating sides with solder and their mating sides with polysulfone and then using heat to solder the non-mating surfaces of strip folds together and the ridges defined by the folds to respective opposed solderable supports. The polysulfone adhesive is thereafter removed by solvation to form interleaved fins between the supports. Springs function to bias the supports away from each other. |
申请公布号 |
JPS60102800(A) |
申请公布日期 |
1985.06.06 |
申请号 |
JP19840116740 |
申请日期 |
1984.06.08 |
申请人 |
INTERN BUSINESS MACHINES CORP |
发明人 |
POORU KOTSUKU |
分类号 |
H05K7/20;H01L21/48;H01L23/433 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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