发明名称 SAAFUESUMAUNTOLEDPATSUKEEJI
摘要 A surface mounted LED package according to the invention includes a housing having a generally rectangular parallelepipedal shape, a first surface that, in use, is adjacent a printed circuit board, a second surface opposite the first surface, a third surface joining the first and second surfaces, a fourth surface opposite the third surface, a first shoulder recessed beneath the first surface, a second shoulder recessed beneath the second surface, a third shoulder recessed beneath the second surface, a fourth shoulder recessed beneath the second surface, and a pssageway extending from the third surface to the fourth surface; a lens received in the passageway and having a radiating surface extending beyond the third surface of the housing, a rear light collecting surface, and a cavity to receive an LED; an LED received in the lens cavity and having a first surface, a second surface opposite the first surface, a first electrical contact on the first surface, a second electrical contact on the first surface, a light emitting portion in the second surface facing the lens; a first conductive spring clip having a first finger engaging the first shoulder, a second finger engaging the third shoulder, and a contact portion in electrical contact with the first electrical contact on the first surface of the LED; and a second conductive spring clip having a first finger engaging the second shoulder, a second finger engaging the fourth shoulder, and a contact portion in electrical contact with the electrical contact on the first surface of the LED. <IMAGE>
申请公布号 JPH0654816(B2) 申请公布日期 1994.07.20
申请号 JP19900125254 申请日期 1990.05.15
申请人 DAIARAITO CORP 发明人 JON KURITERI;KUROOZU AASUTAHERUDO;KAARUTON DEBAUN;BAATO DAUSUTORA
分类号 H05K1/18;F21V19/00;H01L33/48;H05K3/30;H05K3/34 主分类号 H05K1/18
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