| 摘要 |
PURPOSE:To prevent dust from generating on the outside and to eliminate an adverse effect to a semiconductor element by a method wherein a dust collection of burr and so on is executed using a dust collector in a sealed state. CONSTITUTION:The whole peripheries of metal molds 1 add 2 are covered with covers 6-9 and the metal molds are brought into a sealed state. Air nozzles 10 and a dust collector 4 are coupled with the covers 6-9 and are arranged. Resin burrs generated at the time of sealing and molding are removed by a cleaner. At the same time, the air is blown off through the air nozzles 10 provided on the cover 6 and the resin burrs pass through a cover 9 and a dust collecting hose 5 in the cover covered with the covers 6, 7 and 8 and are collected by the collector 4. Thereby, dust is prevented from being raised on the outside and adverse effects to a semiconductor element is eliminated. |
