| 摘要 |
PURPOSE:To change the pattern of the selection of substrates by forming an irregular section to a substrate support bar and selecting and chucking the substrate coinciding with the irregular section pattern. CONSTITUTION:A substrate 5 is held when the diameter of the substrate 5 is larger than the spaces of each projecting section and projecting section of substrate support bars 8 in the relationship of the substrate 5 in a groove section at a certain position of a substrate chucking plate 6 and the substrate support bars 8. When chucking rods are turned respectively at 60 deg., when the spaces of each recessed section and recessed section of the substrate support bars 8 are made larger than the diameter of the substrate 5, on the other hand, the holding of the substrate 5 is released. The substrate support bars 8 have the irregular sections to all grooves of the substrate chucking plates 6, thus operating the chucking plates as substrate chucks for jumping pitches. Accordingly, the substrate support bars 8 have the irregular sections, and the irregular rows are changed over by the rotational operation of the substrate support bars 8, thus conducting the holding and release of holding of an arbitrary silicon wafer. |
