| 摘要 |
PURPOSE:To protect the electric properties of a semiconductor device from being degrade and enhance the reliability of the device by sealing a semiconductor element with low density resin, and what is more, providing a ring-shaped dam on a board. CONSTITUTION:A semiconductor device 10 is loaded on a packaging board 20 with the front surface turned over and depressed under heating, thereby connecting each metal bump 11 of a semiconductor element to its mating lead pad 21 of the board 20. After the semiconductor element 10 is facedown-bonded, low viscosity resin 12, such as epoxy resin is adapted to drop and thermally cured, thereby sealing the semiconductor element 10 with the thermally cured resin. A ring-shaped dam 22 is formed inside the lead pad 21 of the board 20. This dam 22 serves to prevent the low viscosity resin 12 from flowing into an area between the board 20 and the semiconductor element 10. This construction makes it possible to protect he semiconductor device from being degraded and provide high reliability. |
