| 摘要 |
PURPOSE:To provide a device and method for wire bonding by which wires can be bonded with high continuous bondability and bonding strengths. CONSTITUTION:When a lead is bonded at the time of performing the inter- electrode wiring of a semiconductor device by using an insulated bonding wire, the bonding load and output of ultrasonic vibration are switched in two stages. In the first stage, the bonding load is set at a lower level and the vibration output is set at a higher level as compared with the second stage so as to destroy and remove the coating of a jointing section and, in the second stage, the bonding load is set at a higher level and the ultrasonic output is set at a lower level as compared with the first stage so as to bond the lead to an exposed metallic surface. |
