THREE DIMENSIONAL ELECTRONIC CIRCUIT, AS WELL AS METHOD FOR MAKING SAID CIRCUIT

摘要

The caseless electronic elements used are grouped to form a minimum number of output contacts (5) on carriers (1) and the elements are mutually orientated and preliminarily fixed, . before the carriers (1) are made and the elements are finally fixed. An insulating layer (6) is then applied to the current-conducting sections of the elements apart from the contact surfaces of a crystal (2). Any organic impurities and oxide film are removed from the contact surfaces and the contacts (5) of the carriers (1), before conductors (7) are fitted to the surfaces of the elements and of the carriers (1). - The conductors (7) connect the carriers and elements to each other and to the contacts (5) and heat removal is carried out by heat-conducting ribs in the heated zone and a heat sink. Each carrier has at least one external output, which are electrically connected on the surface of the unit, placed inside a hermetic casing.