摘要 |
PURPOSE:To eliminate a step at a bonding part of a nozzle to an ink flow path and simultaneously remove burr, foreign particle, and others by chamfering the end of a nozzle pore after the nozzle pore is opened. CONSTITUTION:A nozzle plate 2 having nozzles 3 is bonded to an end face of a flow path plate 1 having ink flow paths 5. At this time, steps A are formed at the bonding part, as shown by (a), therefore preventing an easy removal of bubbles. The nozzle plate 2 is irradiated with a UV laser beam to be perforated with the nozzles. As a post-machining after perforation, the bonding surface of the nozzle plate 2 is machined by a laser to be chamfered B. In this manner, the steps are eliminated and, simultaneously, burr and foreign particle at the end of the nozzle pore are removed by this chamfering. |