Encapsulation for an electronic component

摘要

The invention relates to an encapsulation (1) for electronic components, for example Hall sensors. This encapsulation has a bottom part (3) and a top part (2) connected thereto by means of a hinge (4). In the bottom part (3) there is provided for the electronic component a depression (13) which is surrounded by webs (23 to 28) which effect an exact positioning of the component. <IMAGE>