| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A lead frame (1) for a multichip type semiconductor device includes at least two square or rectangular islands (2) each of which has four sides and is supported by island supports. Each of the sides of the islands (2) is not parallel to each of the sides of the lead frame to reduce an unwanted bend of leads. <IMAGE> |
| 申请公布号 |
KR950006433(B1) |
申请公布日期 |
1995.06.15 |
| 申请号 |
KR19910003523 |
申请日期 |
1991.03.05 |
| 申请人 |
TOSHIBA CO., LTD. |
发明人 |
OHTSUKA, MASASHI;KATO, TOSHIHIRO |
| 分类号 |
H01L25/18;H01L23/495;H01L23/50;H01L25/04 |
主分类号 |
H01L25/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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