| 摘要 |
An IC lead frame centering method and apparatus whereby centering plates are automatically positioned to center various types of IC. With a screw driver (2) held with a hand, projections (48) of a rotating shaft (45) are inserted into driving bores (29) of a socket wrench (25), and pushed therein toward the socket wrench (25). The pressure causes the socket wrench (25) to slide on a screw rod (7) while compressing a coil spring (30). At the same time, the pressure causes the rotating shaft (45) to compress a coil spring (51), and also causes a cylindrical portion (47) of the rotating shaft (45) to move. The movement of the cylindrical portion (47) is detected by a start switch (52). Consequently, a servomotor (41) is started to drive the screw rod (7) to rotate, causing centering plates (16 and 17) to move away from each other until the centering plate 17 is detected by a mechanical origin sensor (24). The coordinate position of the centering plate (17) is recognized as a mechanical origin, and the centering plates (16 and 17) are moved from this position to a position at which the space therebetween conforms to the width of the IC, which has previously been stored in a centering position memory. <IMAGE> |
