| 摘要 |
PURPOSE: To provide a high-integration electronic circuit package according to an established packaging standard of the semiconductor industry. CONSTITUTION: A circuit assembly 10 comprises a finger lead assembly structured to support an insertion substrate assembly 14 and an electronic circuit device. The substrate assembly 14 has a conductive element to provide electric connection between the finger leads of the lead assembly and the respective circuit sections in the circuit device. The circuit devices are mounted adjacently on the upper surface of the substrate assembly 14. At least one decoupling capacitor, mounted on the lower surface of the substrate assembly at a level lower than that of the finger leads, is electrically connected, via a circuit including an interlayer via connector within the substrate assembly 14, to the respective circuits in the circuit device. |
