| 摘要 |
PROBLEM TO BE SOLVED: To obtain a sawing suspension for wafers which hardly forms crust, can be used repeatedly, and is friendly to the environment by using a specific nonaq. liq. contg. a hard material dispersed therein. SOLUTION: This suspension substantially comprises a nonaq. liq. contg. hard material particles dispersed therein, and the nonaq. liq. is selected from among low-molecular weight polyglycol compds. and their mixtures and pref. has a mol.wt. of 75-150. The suspension is suitable for cutting wafers having diameters of at least 150mm, provides the same effects as obtd. by using an oil-base sawing suspension, has a long life, forms a reduced amt. of crust, is nontoxic, and is excellent in biodegradability. |
