| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive capable of performing bonding at a relatively low temperature, not undergoing resin flow in a process under applied heat and pressure and having improved reliability by including two specified polyimides. SOLUTION: This adhesive is prepared by mixing 100 pts.wt. polyimide comprising 100-30 mol.% at least one type of structural units selected among structural units represented by formulas I and II [Ar is an aromatic-ring-containing divalent group (e.g. group of formula III); R1 to R4 are each H, a 1-4C alkyl or an alkoxyl, provided that not all of them can be H atoms simultaneously] and 0-70 mol.% at least one type of structural units selected among structural units of formulas IV and V (R is a 1-10C alkylene or -CH2 OC6 H4 - with the methylene group bonded to the Si; and x is 1-20) and having a number-average molecular weight of 4,000-400,000, desirably 8,000-200,000 with 5-150 pts.wt. polyimide comprising structural units represented by formula IV and having a number-average molecular weight of 4,000-400,000, desirably 8,000-200,000 and optionally at most 15 pts.wt. silane coupling agent and 0.1-50 pts.wt. filler having a particle diameter of 1 μm or below. |
