| 摘要 |
PROBLEM TO BE SOLVED: To enable a reinforcing board of excellent processability to be manufactured without a complicated process by a method wherein a polyether imide film is made to serve as the reinforcing board pasted on a flexible printed wiring board through adhesive agent. SOLUTION: A conductor circuit 2 is formed on both the sides or the one side of an insulating base material 1 for the formation of a flexible printed wiring board, wherein a copper foil such as a rolled copper foil is provided to both the sides or the one side of the insulating base material 1 of polyester film, polyimide film or the like into one piece by heating and pressing. A reinforcing board 5 is formed of a polyether imide film of thickness 100 to 500μm, whereby the reinforcing board 5 which is high in processability and freely determined in thickness and hardly generates dust can be manufactured under usual processing conditions without using a complicated process.
|
