ARRAY TYPE SEMICONDUCTOR PACKAGE USING A LEAD FRAME AND ITS MANUFACTURING METHOD

摘要

PURPOSE: An array type semiconductor package using a lead frame and a method for manufacturing the same are provided to minimize a thickness of a sealing portion by using a gang bonding method. CONSTITUTION: A semiconductor chip(4) has a multitude of input/output pad(2). A heat-sink plate(6) is adhered on an upper face of the semiconductor chip(4) in order to emit the heat of the semiconductor chip(4). A lead frame(L/F) comprises a multitude of bond finger(24) and a lead(22). The multitude of bond finger(24) is located on a bottom face of the semiconductor chip(4). The lead(22) is formed on an outer circumference of the heat-sink plate(6). A multitude of projection portion(26) is formed on the lead(22). A multitude of conductive bump(14) connects electrically the input/output pad(2) with the bond finger(24). A sealing portion(10) is used for sealing up the semiconductor chip(4), the bump(14), the bond finger(24), and the lead(22).