| 发明名称 |
Method of improving interconnect of semiconductor devices by using a flattened ball bond |
| 摘要 |
A method of forming a semiconductor device assembly comprising forming a wire bump on at least one bond pad on the active surface of a semiconductor device and connecting one end of a wire to the wire bump using a wire bond. The wire bump may be flattened before connecting one end of a wire thereto.
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| 申请公布号 |
US6165887(A) |
申请公布日期 |
2000.12.26 |
| 申请号 |
US19990391638 |
申请日期 |
1999.09.07 |
| 申请人 |
MICRON TECHNOLOGY , INC. |
发明人 |
BALL, MICHAEL B. |
| 分类号 |
H01L21/607;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/607 |
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