| 摘要 |
<p>A method is disclosed for establishing signal contacts (102, 112, 122) on a multilayer printed circuit board (30) having alternating ground and signal layers in a stack-up configuration (32, 34, 36, 38, 40). The signal layers (34, 38) have signal pads (50, 70) and conductive traces (52, 72) leading away from the pads (50, 70). The method comprises the steps of: a) drilling blind signal holes (56, 76) in the printed circuit board (30) down to signal pads (50, 70) on successive signal layers (34, 38), b) filling the blind signal holes (56, 76) with conductive material, and c) removing strips (100, 120) of the printed circuit board (30) nearly down to successive signal layers (34, 38) to provide on each signal layer (34, 38) a strip of exposed signal contacts (102, 122) for the conductive traces (52, 72) thereon.</p> |
