| 摘要 |
PROBLEM TO BE SOLVED: To prevent an high temperature air flow from touching a common device to impede cooling thereof. SOLUTION: A partition panel 5 is disposed substantially in parallel with a printed board 1 and provided with a heat sink 4. The heat sink 4 is coupled with a high heating device 3 through a heat transfer part 4a penetrating the partition panel 5 such that an air flow heated by the heat sink 4 does not touch the common device 2.
|
