HEAT TREATMENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a heat treatment device where treatment gas supply quantity on a substrate at the time of heat treatment is uniformed and the film thickness distribution of the substrate is uniformed. SOLUTION: In the heat treatment device, a shower plate 30 for introducing treatment gas into a treatment chamber in a shower shape is installed above the substrate W in the treatment chamber. In the shower plate 30, a plurality of gas introduction holes 31 are arranged so that they have n-times rotary symmetry (n is the natural number of two or above) with a prescribed symmetric axis As vertical to the substrate W as a center. The symmetric axis As and a rotary axis Ar when the substrate W is rotated are shifted in a direction parallel to the rotary face of the substrate W. The shift distance D2 is set to a range between one fifth of the shortest adjacent interval D1 between the gas introduction holes 31 and half of it.