Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board

摘要

A tape substrate (110) includes IC lands (113) electrically connected to pins of a driver IC (integrated circuit) (80), circuit board terminal lands (112) electrically connected to an external circuit board, test lands (115) for testing the driver IC (80) mounted on the tape substrate (110), and a plating terminal (116) used for plating the land (112,114). The test lands (115) are arranged in matrix. The plating terminal (116) is disposed so as to surround the IC lands (113), the circuit board terminal lands (112), and the test lands (115).