发明名称 HEATING AND COOLING APPARATUS
摘要 PROBLEM TO BE SOLVED: To reduce the frequency of apparatus maintenance by swiftly heating and cooling to a temperature required by a load. SOLUTION: A heating and cooling apparatus 2 uses a medium capable of heating to a heating limit temperature of 200°C or higher and cooling to 0°C or lower in a liquid phase state. A heating medium circulation circuit C3 includes a heater 24 for heating the medium to a temperature higher than a heating set temperature required by the load W, supplies a heated medium to the load W through a third supply flow path 26 and returns the medium supplied to the load W through a forth return flow path 37. A cooling medium circulation circuit C2 includes a cooler 14 for cooling the medium to a temperature lower than a cooling set temperature required by the load W, and returns the medium supplied to the load W through a fifth return flow path 38. In response to the requirement of the load W, the circulation circuits C2 and C3 are switched to heat and cool the load W. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005205876(A) 申请公布日期 2005.08.04
申请号 JP20040160202 申请日期 2004.05.28
申请人 INNOTECH CORP 发明人 OGAWARA YOSHIO;SATO TOSHIHIRO
分类号 B29C33/04;(IPC1-7):B29C33/04 主分类号 B29C33/04
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