| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing liquid composition which is less in residues of abrasive grains and polishing chips generated during the polishing on a polished substrate after completing the polishing, high in polishing speed, and capable of keeping smoothness of the substrate, and to provide a substrate manufacturing method using the polishing liquid composition. <P>SOLUTION: The polishing liquid composition contains organic nitrogen compound having two or more amino groups and/or imino groups in a molecule, organic polybasic acid, polishing material, and water. The substrate manufacturing method has a step of feeding the polishing liquid element to a substrate at a rate of 0.01-0.5 mL/minute per 1 cm<SP>2</SP>of the substrate to be polished, and polishing the substrate by using a polishing pad. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
