| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a shield member for protecting a plurality of electronic components against electromagnetic waves, capable of downsizing and also improving productivity. <P>SOLUTION: A ground terminal 56 is provided inside an electronic component provided region E, and a plurality of individual components 70 and a semiconductor chip 75 are covered with transfer mold resin 83. In addition, an opening 93 for exposing the ground terminal 56 is formed on the transfer mold resin 83, and the shield member 86 is electrically connected with the ground terminal 56 via a conductive adhesive 84. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
