| 摘要 |
A component supplying device is provided with a wafer holder, a first component pick-up device, and a second component pick-up device. The first and second component pick-up devices are movable along first and second guides, respectively. The first component pick-up device is movable between a pick-up position located near the wafer holder and a first supply position, while the second component pick-up device is movable between the pick-up position and a second supply position.
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