发明名称 Method of manufacturing a vertically-structured GaN-based light emitting diode
摘要 The present invention relates to a method of manufacturing a vertically-structured GaN-based light emitting diode. The method of manufacturing a vertically-structured GaN-based light emitting diode includes forming a GaN layer on a substrate; patterning the compound layer in a predetermined shape; forming an n-type GaN layer on the patterned compound layer through the epitaxial lateral over-growth process and sequentially forming an active layer and a p-type GaN layer on the n-type GaN layer; forming a structure supporting layer on the p-type GaN layer; sequentially removing the substrate and the GaN layer formed on the substrate after forming the structure supporting layer; removing the patterned compound layer exposed after removing the GaN layer so as to form an n-type GaN layer patterned in a concave shape; and forming an n-type electrode on the n-type GaN layer patterned in a concave shape.
申请公布号 US7306964(B2) 申请公布日期 2007.12.11
申请号 US20060430990 申请日期 2006.05.10
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE JAE HOON;CHOI HEE SEOK;OH JEONG TAK;LEE SU YEOL
分类号 H01L21/00;H01L33/32 主分类号 H01L21/00
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