| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation characteristics and the moisture absorbing characteristics of a semiconductor device, having a structure such that a semiconductor element is installed in its package and is sealed with a cap member in airtight way, and to obtain high quality and high reliability. SOLUTION: In the semiconductor device, there are provided high-thermal-conduction portions 11, having a higher thermal conductivity than the material of a package 1 so as to be passed through the package 1, and to be contacted with a semiconductor element 3. Furthermore, on the outer surface of the package 1, there is provided a heat radiating plate 10 connected to the high-thermal-conduction portions 11. Consequently, since the heat generated from the semiconductor element 3 is efficiently conducted to the heat radiating plate 10 via the high thermal conductors 11 and can escape directly from the heat radiating plate 10 to a peripheral environment, the semiconductor device becomes superior in its heat radiation characteristics. COPYRIGHT: (C)2008,JPO&INPIT |
