| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated polyimide film in which a reinforcing backing film having proper strength, dimensional stability by thermal deformation, and peelability is laminated when, for example, a flexible printed circuit is processed/produced, and a thin functional film such as copper is formed on the other surface. SOLUTION: In a method for producing the laminated polyimide film, with the use of the polyimide film (which is) 0.5-10μm in thickness with the reinforcing backing film laminated on one surface, the layer of the thin functional film is formed on the other surface different from the surface on which the reinforcing backing film is laminated of the polyimide film. In the laminated polyimide film obtained by the method, the thin functional film layer is formed on the other surface of the polyimide film of 0.5-10μm in thickness with the reinforcing backing film laminated on one surface. COPYRIGHT: (C)2008,JPO&INPIT |
