| 摘要 |
PROBLEM TO BE SOLVED: To obtain a heat conductive grease which can maintain proper heat conducting performance for a long time, has proper viscosity, facilitates handling, and contributes to improvement in productivity. SOLUTION: The heat conductive grease 20 has characteristics of: (1) the upper limit value of thermal resistance being 0.05°C/W at pressurization, applying a load of 2×10<SP>5</SP>Pa or higher between an IC chip 14 and a heat sink 15; (2) the viscosity at normal temperature is within a range of 100 Pa s or higher and 300 Pa s or lower; and (3) the value specified by thickness/area is 0.6/m or smaller, when it is placed between the IC chip 14 and the heat sink 15. COPYRIGHT: (C)2008,JPO&INPIT |
