发明名称 |
Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating |
摘要 |
A method is provided including, after joining a wiring substrate and an element substrate, separating a second substrate of the element substrate from a semiconductor element, and electrically coupling an element-side terminal that has been exposed by the separation to a wiring-side terminal disposed outside the semiconductor element by electroless plating.
|
申请公布号 |
US7326639(B2) |
申请公布日期 |
2008.02.05 |
申请号 |
US20050102903 |
申请日期 |
2005.04.08 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
AKAGAWA SUGURU;YODA TSUYOSHI |
分类号 |
G02F1/1345;H01L21/44;G02F1/1337;G02F1/1368;G09F9/00;G09F9/30;H01L21/02;H01L21/336;H01L21/52;H01L21/60;H01L21/77;H01L21/84;H01L23/48;H01L23/52;H01L23/538;H01L27/12;H01L27/32;H01L29/40;H01L29/786;H01L51/50;H05B33/14 |
主分类号 |
G02F1/1345 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|