SOLDERING STRUCTURE AND METHOD USING Zn

摘要

PROBLEM TO BE SOLVED: To provide a soldering structure whose characteristics are improved by involving high reactive Zn to the interfacial reaction of the soldering.

SOLUTION: A soldering structure using Zn includes a bonding layer which contains Zn; and a lead-free solder which bonds and reacts to the bonding layer. The bonding layer can be a Zn alloy layer or a multilayer including a Zn layer.

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