A thermal interface material

摘要

A thermal interface material (1) comprises a bulk polymer (2) within which is embedded sub-micron (circa 200 to 220nm) composite material wires (3) having Ag and carbon nanotubes (CNTs) 4. The CNTs are embedded in the axial direction and have diameters in the range of 9.5 to 10nm and have a length of about 0.7um. In general the pore diameter can be in the range of 40 to 1200nm. The material (1) has particularly good thermal conductivity because the wires (3) give excellent directionality to the nanotubes (4) û providing very low resistance heat transfer paths. The TIN is best suited for use between semiconductor devices (e.g. power semiconductor chip) and any type of thermal management systems for efficient removal of heat from the device.