发明名称 RESIN-MOLD-TYPE CAPACITOR AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin-mold-type capacitor used for an automobile etc. which is downsized and is excellent in moisture resistance. SOLUTION: A capacitor element 1 connected with a bus bar 2 is covered with an outer package 3 of a norbornane resin, a communication hole 3a communicating between a part of the capacitor element 1 and outside is located on the outer package 3, and the communication hole 3a is buried by a resin, therefore, a resin case becomes unnecessary, the miniaturization and reduction in cost are made, and the improvement of productivity can be attained. Moreover, the moisture absorbed inside of the capacitor element 1 is evaporated by the heat produced in hardening of the norbornane resin, the moisture can be discharged outside through the communication hole 3a, and besides, since the communication hole 3a is buried by the resin, the moisture is prevented from entering from the outside, and the high moisture resistance can be kept. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009049149(A) 申请公布日期 2009.03.05
申请号 JP20070213236 申请日期 2007.08.20
申请人 PANASONIC CORP 发明人 TAKEOKA HIROKI;SHIMAZAKI YUKIHIRO
分类号 H01G4/18;H01G4/224;H01G4/32 主分类号 H01G4/18
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