发明名称 CHIP-ON GLASS TYPE DISPLAY MODULE AND ITS MOUNTING INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To reduce man-hours by simultaneously performing mounting inspection of a driving IC and mounting inspection of an FPC in a COG type display module. SOLUTION: The driving IC 13 includes first and second dummy terminals 13c1 and 13c2 electrically connected to each other in the inner part of the driving IC 13. A glass substrate 11 includes: first and second fixing electrodes 11c1 and 11c2 to which the first and the second dummy terminals 13c1 and 13c2 of the driving IC 13 are electrically connected, respectively; and third and fourth fixing electrodes 11e1 and 11e2 electrically connected to the first and the second fixing electrodes 11c1 and 11c2, respectively. The FPC 14 includes: third and fourth dummy terminals 14e1 and 14e2 electrically connected to the third and the fourth fixing electrodes 11e1 and 11e2, respectively; and first and second electrodes 14g1 and 14g2 for inspection electrically connected to the third and the fourth dummy terminals 14e1 and 14e2, respectively. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009047877(A) 申请公布日期 2009.03.05
申请号 JP20070213353 申请日期 2007.08.20
申请人 EPSON IMAGING DEVICES CORP 发明人 NAKAMURA YOSHIO
分类号 G02F1/1345;G01R31/02;G02F1/13;G09F9/00;H01L21/60 主分类号 G02F1/1345
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