发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 A semiconductor device includes a semiconductor element, a lead, and a gold wire electrically connecting an electrode of the semiconductor element and the lead. In the semiconductor device, the gold wire is covered with a metal and is a continuous film formed by plating.
申请公布号 US2009072395(A1) 申请公布日期 2009.03.19
申请号 US20080208718 申请日期 2008.09.11
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 IGUCHI TOMOHIRO;NISHIUCHI HIDEO;HIGUCHI KAZUHITO;KITANI TOMOYUKI
分类号 H01L23/498;H01L21/60 主分类号 H01L23/498
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