| 摘要 |
PURPOSE:To reduce a chip size by providing a through hole, for which a conductive material is formed on the surface of the internal wall, from the surface of a substrate to the rear face and specifying the depth of this through hole. CONSTITUTION:This circuit is provided with a main line 1 composed of a microstrip line, a through hole 2 from the surface of a semiconductor substrate 4 to the rear face is formed so that the depth L can be equal to the 1/4 wavelength of a desired frequency, and metalized conductive metal 3 is formed on the internal wall surface of this through hole 2 by plating gold or the like. Therefore, a ground conductor 5 showing the ground plane on the rear face of the substrate can be formed. Since the ground plane can be prepared on the rear face of the substrate, a fan-shaped stub or the like can be manufactured on the rear face of the substrate by effectively utilizing the area. On the other hand, since the package is used for feeding power from the substrate rear face of the microwave integrated circuit to this circuit, a process for spreading a wire is unnecessitated. In this case, by providing a groove between a power feeding circuit part and the ground conductor 5, at the time of adhesion, any excess solder can be prevented from flowing into any unwanted part and short- circuiting. |
