| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck capable of enhancing uniformity of in-plane temperature distribution of a processed object, and to provide a wafer processing apparatus.SOLUTION: An electrostatic chuck includes a ceramic dielectric substrate of polycrystalline ceramic sintered compact having a first principal surface for mounting a processed object, and a second principal surface on the opposite side of the first principal surface, an electrode layer provided on the ceramic dielectric substrate, a base plate provided on the second principal surface side and supporting the ceramic dielectric substrate, and a heater provided between the electrode layer and base plate. The base plate has a through hole penetrating the base plate, and an interconnection path passing a medium for adjusting the temperature of the processed object. When viewing in a direction perpendicular to the first principal surface, at least a part of the heater exists on the side of the through hole, viewing from a first part of the interconnection path closest to the through hole.SELECTED DRAWING: Figure 2 |
