SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

Disclosed is a semiconductor package. The semiconductor package may include a semiconductor chip mounted on a substrate, an insulating layer which is adjacent to the semiconductor chip and includes a thixotropy material or a phase change material, and a shielding layer which covers the semiconductor chip and the insulating layer. Disclosed is a method for manufacturing a semiconductor package to manufacture the shielding layer and the insulating layer having high aspect ratio by using a 3D printer. So, the semiconductor package can be made thin and simple.