| 摘要 |
PURPOSE:To provide a method for mass producing glucose sensor having a uniform limit transmission film. CONSTITUTION:Photoresist 24 is applied entirely on the surface of a wafer 21 and then the resist is removed from predetermined parts by photolithography. A mixture solution 25 of protein and bridging agent is then applied entirely on the surface of the wafer 21 and gelatinized followed by application of a mixture solution 26 of a protein containing silicon and a bridging agent onto the surface of the wafer 21 and gelatinization thereof. The wafer 21 is then treated in an organic solvent where the photoresist is dissolved thus forming an albumin bridged film 25 and a limit transmission film 26. Similarly, a glucosidases fixed film 28 and a limit transmission film 29 are formed using a mixture solution of a protein containing glucosidases and a bridging agent. The wafer formed with the protein bridge film 25, the glucosidases fixed film 28, and the limit transmission films 26, 29 is cut into chips. |
