| 摘要 |
PURPOSE:To control the outward protrusion of a bonding agent from a heat diffusing plate at the time of sticking the plate and, at the same time, to finish the end section of a bonding agent layer at the end section of the plate to have a good appearance by providing notched sections on both the front and rear surfaces of the plate at its peripheral section. CONSTITUTION:In the title device in which the heat generated from a semiconductor chip 5 is radiated from a heat radiating fin 1 through a heat diffusing plate 1, notched sections are provided on both the front and rear surfaces of the plate 1 in its peripheral end section. For example, a semiconductor device using a pin-grid array type package is constituted so that the device can be provided with a heat radiating fin 1, silicone rubber based bonding agent 2, heat diffusing plate 3, pin-grid array type package base 5, chip 5, bonding wires 6, sealing material 7, cap 8, and lead pins 9. Both the front and rear surfaces of the plate 3 composed of a metallic plate of aluminum, etc., is notched in tapered states 10 of about 45 deg. in its peripheral section. |
