| 摘要 |
PURPOSE:To prevent the generation of warpage or distortion, to enhance dimensional accuracy, to enable the fine wiring of a circuit and to reduce production cost by arranging a sheet like adhesive composed of a thermosetting resin of a B-stage between a prepreg and copper foil and subjecting the prepreg and the copper foil to laminate molding. CONSTITUTION:Metal foil composed of copper foil or the like is arranged to the single surface or both surfaces of a predetermined number of laminated prepregs and a sheet like adhesive composed of a thermosetting resin such as a phenol resin of a B-stage is arranged between the prepregs and the copper foil. The whole is subjected to pressure molding under heating. As the adhesive used herein, a compsn. prepared by adding a resole type phenol resin and an epoxy resin to a polyvinyl butyral resin is designated. The thickness of the sheet like adhesive is pref. set to 10-50mum because sufficient bonding strength and solder heat resistance are not obtained in the case of below 10mum and heat resistance and punching properties are lowered in the case of 50mum or more. |
