| 摘要 |
To bond the beam leads of a plurality of integrated circuit chips to a metallization layer on a transparent compliant film, the chips are first registered in matching etched holes on a flat ground steel block. The flat beam leads lie on the surface of the block and support the chips. The film is arranged on top of the etched block with its metallization pattern in alignment with the corresponding beam leads. At room temperature the film is pressed downwardly on top of the exposed beam leads by an opposing flat ground block. Heat is then applied for bonding, and pressure is maintained until the assembly cools to prevent misregistration.
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