| 摘要 |
It is required that the open groove on the rounded portion of wire terminals, to which the wire is attached, be brazed shut or otherwise permanently filled. In accordance with this invention, a brass or copper wire terminal is plated with a very thin layer of silver, tin, or both. The surface is thereafter oxidized by heating in air. The assembly is then heated in a reducing atmosphere and, by virtue of eutectic brazing, an excellent metallurgical bond fills the groove. No solder or brazing alloys are used. This invention is a refinement of the bonding process disclosed in U.S. Pat. application Ser. No. 873,721 filed Nov. 3, 1969.
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