发明名称 FLEXIBLE FILM PCB AND MANUFACTURING METHOD THEREOF
摘要 The method for fabricating a flexible film print circuit board includes the steps of depositing a metal on a flexible film at a low temperature, patterning the metal layer into a predetermined pattern, forming an oxide layer on the pattern, thereby reducing error during the pattern formation.
申请公布号 KR940010437(B1) 申请公布日期 1994.10.22
申请号 KR19920019272 申请日期 1992.10.20
申请人 HYUNDAI ELECTRONICS CO., LTD. 发明人 KU, BON - HONG
分类号 H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/00
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