发明名称 METHOD OF FABRICATING SEMICONDUCTOR DEVICE
摘要 <p>Method of manufacturing a semiconductor device comprising a body which consists of semiconductor material of the III-V compound type and which is formed by an n-type substrate (1, 2, 3, 4) and a substrate-adjoining region (5, 6) having conductivity properties differing from the substrate, zinc or cadmium being introduced at least over a part (13) of the surface (14) of the region into the region and being diffused to the substrate, characterized in that the net donor concentration in the substrate near the junction (10) between the region and the substrate is chosen to be so high that the diffusion of zinc or cadmium in the substrate near the junction (11) between the region and the substrate is retarded. </p>
申请公布号 JPS5575218(A) 申请公布日期 1980.06.06
申请号 JP19790152154 申请日期 1979.11.26
申请人 PHILIPS NV 发明人 KURISUCHIANUSU YOHANESU MARINU;HENDORIKU FUIINFURIITO
分类号 H01L21/22;H01L21/223;H01L29/36;H01L33/00;H01S5/00 主分类号 H01L21/22
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