摘要 |
PURPOSE:To heighten productivity, by placing the connections of the leads of diodes with terminal plates on an identical plane protruded from the surface of a connection stage and by placing auxiliary diodes on a plane different from that for the connections and by simultaneously soldering the connections. CONSTITUTION:Recesses 40a-40c for tightly fitting and holding auxiliary diodes 3a-3c are provided on a connection stage 35 near the insides of cooling fins 22. The auxiliary diodes are held in the recesses. The connections of the leads 6a-6c, 9a-9c of diodes 1a-1c, 2a-2c with the terminals a-c, d-f of terminal plates 31-34 are located on an identical plane protruded from the connection board 35 and are located on a line almost concentric with an almost semicircular line defined by the fins 22 or the stage. As a result, the connections are simultaneously soldered in a molten solder container. Since the auxiliary diodes are located away from the solder container, the auxiliary diodes are not affected by heat. This results in heightening productivity. |