发明名称 |
Impedance match connection using multiple layers of bond wires |
摘要 |
A bond wire connection between two semiconductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common electrical connection point. As more layers are added the net impedance can be controlled so as to match the impedance driving the downstream semiconductor.
|
申请公布号 |
US4686492(A) |
申请公布日期 |
1987.08.11 |
申请号 |
US19850708129 |
申请日期 |
1985.03.04 |
申请人 |
TEKTRONIX, INC. |
发明人 |
GRELLMANN, H. ERWIN;ROLAND, LEONARD A. |
分类号 |
H03H7/38;H01L23/50;H01L23/66;H01L25/04;H01L25/16;H01L25/18;H01L27/13;H01P3/08;H01P5/02;H01P5/08;(IPC1-7):H01P5/00 |
主分类号 |
H03H7/38 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|